Showing results: 16 - 21 of 21 items found.
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Ansys Corporation
Ansys structural analysis software enables you to solve complex structural engineering problems and make better, faster design decisions. With the finite element analysis (FEA) solvers available in the suite, you can customize and automate solutions for your structural mechanics problems and parameterize them to analyze multiple design scenarios. You can also connect easily to other physics analysis tools for even greater fidelity. Ansys structural analysis software is used across industries to help engineers optimize their product designs and reduce the costs of physical testing.
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OpTest™ MTF -
Optikos Corporation
The Optikos OpTest™ MTF Testing Equipment is the most flexible and complete system for characterizing the optical performance of optical elements, lens assemblies and optical imaging systems in Infinite Conjugate, Finite Conjugate and Afocal configurations spanning the UV, Visible, NIR, SWIR, MWIR and LWIR spectral regions . OpTest™ software drives Optikos hardware, is easy to use and controls all motion control, image acquisition, configuration set-up and data reporting.
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The Test Connection, Inc.
In addition to the highest quality test programming, maximizing board coverage, and efficient board testing, TTCI offers a full array of other engineering services, including CCA (Circuit Card Assembly) Testing, Design for Test, ASTER TestWay electrical design for test analyzer, Feasa LED analyzer, SMH Technologies FlashRunner in-system programmer, finite element analysus, installation, reverse engineering of Gerber to CAD, Training, Test System PC, Hardware, and Software Upgrades, and more.
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Crystal instruments
EDM Modal Correlation Analysis allows the user to correlate two modal models; EMA and/or FEA models. Comparing the experimental data with that acquired through finite element analysis helps in validating the test results. Users can import the geometry model and mode shape data from FEA or EMA software. A modal mapping procedure is executed to match the EMA and FEA models. After this matching procedure, the new mode shape information from FEA is interpolated and the FEA modal parameters are displayed alongside with EMA results. Finally, to observe the correlation between the results from the two methods, a Cross-MAC matrix is calculated and shown.
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Response Dynamics Vibration Engineering, Inc.
We have consulted on thermal issues ranging from conduction issues in TECs, thermal radiation modeling, and countless air cooled system issues relating to system performance, vibration, and acoustics noise. We use a wide array of thermocouple instrumentation, thermal imaging, flow measurements, as well as finite element analysis and analytic modeling to measure, design, and debug thermal and related issues. We often work on customer products in our Response Dynamics lab where we characterize the system, engineer solution options, and prototype solutions. We then work with the customer to work the winning solution into their quality control and manufacturing process.
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Circuit Check, Inc.
Circuit Check began Strain Gauge Testing in 1999 when BGA/SMT technology started replacing PTH components, reducing strain levels was a reactive post fixture fabrication process. We quickly recognized that the “reactionary” process was neither efficient nor were we capable on knowing the lowest achievable strain levels. Our engineering team came up with visual tools utilized during design to easily identify areas of excessive probe force, though still not enough data was generated to identify the lowest possible strain. Finite Element Analysis software models the PCBA and test fixture and applies the pressures from test probes and board supports and indicates the micro strain level applied to the PCBA. Using the FEA software during our design process allows our engineers to modify fixture designs to attain the lowest possible micro strain before fabrication begins.
